Bond Strength/Disbonding Behavior and Dimensional Stability of Wood Materials with Different Adhesives


Kurt S., Uysal B.

JOURNAL OF APPLIED POLYMER SCIENCE, cilt.115, ss.438-450, 2010 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 115 Konu: 1
  • Basım Tarihi: 2010
  • Doi Numarası: 10.1002/app.31038
  • Dergi Adı: JOURNAL OF APPLIED POLYMER SCIENCE
  • Sayfa Sayıları: ss.438-450

Özet

In this study, we aimed to describe the effects of adhesives [poly(vinyl acetate) (PVAc), Desmodur vinyl trie ketonol acetate, and urea formaldehyde (UF)] on wooden materials (Scotch pine and oriental beech) cut tangentially and radially impregnated with Protim Solignum, chromate copper arsenate (CCA), and Celcure AC 500 and exposed to humidity and water and heat-resistance, heating, and cooling tests. For the adhesives, the highest swelling (4.3%) was obtained for oriental beech bonded with UF and cut radially, and the lowest swelling (1%) was obtained for Scotch pine bonded with PVAc and cut radially. For the control samples, the humidity-resistance, water-resistance, heat-resistance, and heating and cooling tests decreased the bonding strength. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 115:438-450, 2010