On the von Mises elastic stress evaluations in the bi-adhesive single-lap joint: a numerical and analytical study


ÖZ Ö. , ÖZER H.

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, cilt.28, ss.2133-2153, 2014 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 28 Konu: 21
  • Basım Tarihi: 2014
  • Doi Numarası: 10.1080/01694243.2014.948110
  • Dergi Adı: JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
  • Sayfa Sayıları: ss.2133-2153

Özet

Bi-adhesive joints are an alternative stress-reduction technique for adhesively bonded joints. The joints have two types of adhesives in the overlap region. The stiff adhesive should be located in the middle and the flexible adhesive at the ends. This study is the extension of our previous paper to the von Mises stress evaluation and discusses the values and importance of the von Mises stresses in the bi-adhesive single-lap joint. Both analytical and numerical analyses were performed using three different bi-adhesive bondline configurations. The Zhao's closed form (analytic) solution used includes the bending moment effect. In the finite element models, overlap surfaces of the adherends and the adhesives were modeled using surface-to-surface contact elements. The contribution levels of the peel and shear stresses for producing a peak von Mises stress are also studied. It is concluded that the contribution level of the shear stress at where von Mises stress becomes peak is more than that of the peel stress. Joint strength analyses were performed based on the peak elastic von Mises stresses. It is seen that joint strength can be increased using bi-adhesive bondline. The analytical and numerical results show that the appropriate bond-length ratio must be used to obtain high joint strength.