Investigation of the wetting properties of ternary lead-free solder alloys on copper substrate


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Omac F., Ozyurek D., Erer M.

Acta Physica Polonica A, cilt.131, ss.165-167, 2017 (SCI Expanded İndekslerine Giren Dergi) identifier

  • Cilt numarası: 131 Konu: 1
  • Basım Tarihi: 2017
  • Doi Numarası: 10.12693/aphyspola.131.165
  • Dergi Adı: Acta Physica Polonica A
  • Sayfa Sayıları: ss.165-167

Özet

In the present study, wetting behaviors of Sn-9Zn-x Al ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-x Al alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9 degrees C. It was determined that wetting capability of Sn-9Zn-x Al alloys failed because of oxidation.