Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate


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ERER A. M.

JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI, cilt.21, ss.587-589, 2018 (ESCI İndekslerine Giren Dergi)

  • Cilt numarası: 21 Konu: 3
  • Basım Tarihi: 2018
  • Doi Numarası: 10.2339/politeknik.399077
  • Dergi Adı: JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI
  • Sayfa Sayısı: ss.587-589

Özet

In this study, effect of melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures (250, 280 and 310 degrees C). The melting temperatures of alloys were examined by differential scanning calorimeter (DSC) that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90 degrees at 310 degrees C on Cu substrate.