THERMAL CONDUCTIVITY OF LAMINATED VENEER LUMBERS BONDED WITH VARIOUS ADHESIVES AND IMPREGNATED WITH VARIOUS CHEMICALS


Uysal B. , Kurt S., Ozcan C.

BIORESOURCES, cilt.4, ss.756-770, 2009 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 4 Konu: 2
  • Basım Tarihi: 2009
  • Dergi Adı: BIORESOURCES
  • Sayfa Sayıları: ss.756-770

Özet

In this study it is aimed to describe the effects of adhesives (PVAc-Desmodur VTKA and Urea formaldehyde) on wooden materials (Scotch pine and oriental beech) cut tangentially and radially impregnated with Tanalith-C, creosote, and sodium silicate in layer (3, 4, 5) of laminated veneer lumber (LVLs) on thermal conductivity. The lowest thermal conductivity of 0.103 Kcal/mh degrees C was obtained in Scotch pine, cut tangentially, impregnated with creosote, bonded with urea formaldehyde, and 3 layer LVL. The highest thermal conductivity of 0.185 Kcal/mh degrees C was obtained in oriental beech, cut radially, impregnated with Tanalith-C, bonded with PVAc, and 5 layers LVL. Consequently, oriental beech wood cut radially and impregnated with Tanalith-C, bonded with PVAc adhesive and 5 layers in LVL can be used as a material in construction where the thermal conductivity is required. Scotch pine wood cut tangentially and impregnated with creosote, bonded with urea formaldehyde adhesive and 3 layers in LVL can be used as a material in construction where the insulation is required.