Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

Erer A. M. , Candan E., Guven M. H. , Turen Y.

EPJ Applied Physics, cilt.54, 2011 (SCI Expanded İndekslerine Giren Dergi) identifier

  • Cilt numarası: 54 Konu: 1
  • Basım Tarihi: 2011
  • Doi Numarası: 10.1051/epjap/2011100487
  • Dergi Adı: EPJ Applied Physics


The contact angle (Theta) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 degrees C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Theta up to 3.5 wt.% above which the Theta value was increased. Increasing alloy temperature also decreased the Theta proportionally. Experimental results revealed that a correlation between the Theta, alloy composition and the alloy temperature exists which yielded an empirical model to predict the Theta at a given Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Theta reasonably well with the present work and the other published works.